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01-Wafer Inspection
02-Wafer Grinding
03-Wafer Dicing
04-SMT
05-Die Bonding
06-Plasma Cleaning
07-Wire Bonding
08-Encapsulation
09-Encapsulation
10-Laser Cutting
11-Water Jet Cutting
12-Final Testing
13-Laser Marking
14-Color Printing
Process Testing
Tensile Strength Tester – Testing Equipment
Mould Pressing
Die Testing Workshop
Card Opening Test
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